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AMADA WELD TECH glovebox welding systems combine a controlled-atmosphere enclosure with resistance or laser welding equipment for hermetic sealing applications. Integrating part handling and welding within the glovebox allows sensitive components to be processed without exposure to ambient air.
Our configurable systems support electronic, optoelectronic and semiconductor package sealing, along with other applications requiring controlled welding environments. Enclosure options, atmosphere controls, vacuum bakeout ovens and antechambers can be selected to match the parts, process and production requirements.
A glovebox provides a sealed workspace where operators handle components through glove ports. Gas controls and monitoring help maintain the atmosphere required for the application, including control of moisture, oxygen, pressure and gas composition.
Atmosphere control is one part of the hermetic sealing process. Components may also require preparation to remove moisture before welding. Vacuum bakeout ovens help remove moisture and volatile materials, while vacuum/backfill antechambers provide a controlled method for transferring parts into the enclosure. Gas purification systems can recirculate process gas to remove moisture and oxygen.
Available capabilities depend on the selected system and configuration.
Glovebox enclosures can be configured with resistance welding (including parallel seam sealing or projection welding) or laser welding equipment. Bringing the joining process into the controlled environment allows component handling, positioning and sealing to take place within one integrated system.
The appropriate welding technology depends on the package materials, joint design, required seal and production requirements. Tooling, fixturing and motion equipment can be configured around the application.
Selecting a system starts with the package and the process. Important considerations include the materials being joined, welding technology, atmosphere requirements, component preparation, workspace, production volume and required level of process control.
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