Standard Systems for Hot Bar Reflow Soldering & Bonding

Standard desktop configurations for pulse heated hot bar reflow soldering and bonding. Systems include a power supply, bonding head and mechanism for part load/unload which may be a linear slide or rotary.

Hot bar reflow soldering is a selective soldering process in which two solder plated parts are pressed together and heated to a temperature adequate to cause the solder to melt and flow, after which the parts are cooled to form a permanent electro-mechanical bond. The process is accomplished using a thermode which is quickly heated and then cooled down for each connection resulting in strong joints. Pressure is applied throughout the entire cycle resulting in precise positioning.

Standard Systems

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