Standard Systems for Hot Bar Reflow Soldering & Bonding and Heatstaking

Standard systems provide a practical alternative to a fully customized integrated system when an application can be accommodated by an established machine configuration.

Hot Bar Reflow Soldering and Bonding

Hot bar reflow soldering is a selective soldering process in which two solder-plated parts are pressed together and heated until the solder melts and flows. A thermode applies heat and pressure to the connection and is then cooled while pressure is maintained, forming a permanent electro-mechanical bond. Precise control of temperature, force, and time is important to achieving a repeatable hot bar soldering or bonding process.

Standard systems can also be configured for ACF bonding and laminating, providing controlled heat and pressure for applications using anisotropic conductive film.

Heatstaking

Heatstaking is used to join components where at least one part is plastic. The plastic is heated above its glass transition temperature using a thermode or super-heated air and then deformed under pressure to create the stake. The material is subsequently cooled under pressure to maintain fixation of the joined parts.

Standard System Configurations

AMADA WELD TECH standard hot bar systems are available in configurations designed for different process and force requirements, including:

• Low- to mid-force hot bar reflow soldering, ACF bonding, and heatstaking. Systems include a power supply, bonding head, optional rotary or linear slide part handling, tape dispensing and more.
• Mid- to high-force hot bar reflow soldering, ACF bonding, and heatstaking. Systems include a power supply, bonding head, optional rotary or linear slide part handling, tape dispensing and more.

These standard platforms provide manufacturers with established equipment configurations while offering options to accommodate the specific joining process and production requirements.