Standard Systems for Hot Bar Reflow Soldering & Bonding and Heatstaking

Standard desktop configurations for pulse heated hot bar reflow soldering and bonding. Systems include a power supply, bonding head and mechanism for part load/unload which may be a linear slide or rotary.

Hot bar reflow soldering is a selective soldering process in which two solder plated parts are pressed together and heated to a temperature adequate to cause the solder to melt and flow, after which the parts are cooled to form a permanent electro-mechanical bond. The process is accomplished using a thermode which is quickly heated and then cooled down for each connection resulting in strong joints. Pressure is applied throughout the entire cycle resulting in precise positioning.

Heatstaking is the most efficient way to  bond metal to plastic.  It is the method of joining two or more parts, where at least one is made out of plastic. The process is accomplished by heating the plastic to a temperature above the glass transition temperature via the use of super-heated air or a thermode, and then applying pressure in order to deform it and create the stake. The plastic is then cooled down again – under constant pressure – below the glass transition temperature, ensuring good fixation of the parts. This cooling can be done with compressed air if using a thermode, or with a cold, preformed tool if super-heated air is used.