Find suggested replacement products here
Learn when you might choose one technology over the other in this blog piece: Nd:YAG for Fiber Laser Welding?
Use a picosecond laser for corrosion resistant black marking on stainless steel alloys: UDI marking, banding, part traceability
What’s all the fuss about? Read about micromachining with a femtosecond laser in our blog.
What is it and what can you do with it?
Laser soldering and plastic welding; both possible with direct diode lasers
Read our blog piece Bringing Laser Technology In House: 6 Simple Steps to Success which outlines some of the pitfalls and how to avoid when moving from contract manufacturing.
How to design ring projections for hermetic sealing.
Configure your Glovebox here
Flexible circuit design for hot bar reflow soldering
Check out these tips and tricks for successful setup of your micro tig welding application.
Laser or resistance technology? Which do you choose when it’s critical to prevent external environmental conditions from penetrating the package?
Projection welding of Fasteners to Hot Stamped Boron Components
Laser Cleaning Metal Improves Battery Pack Reliability. Read the blog now.
Industry increasingly relies on sensors in both factories and products. New sensor technologies mean new product capabilities with improved performance and efficiency.
Fast, clean, efficient! Read the blog.
Dark marks that are resistant to bacterial growth, passivation, corrosion and autoclaving. Read more.
High production rate + high yield = industrial process success. Understanding both the process requirements and production environment allows companies to optimize their production rates resulting in lower cost per part and higher profit.
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Semiconductor devices are made up of small crystals of silicon semiconductor designed to carry out a number of electronic functions in an integrated circuit. The semiconductor industry manufactures a variety of integrated circuits (IC’s) with varying packaging requirements. The packaging, typically made of metal or ceramic, is designed to protect the semiconductor from damage and contamination. Typical packaging styles include TO packages, butterfly packages, 16 lead flat packs and 8 pin DIPs.
AF8500 Hermetic Sealing System
Seam Sealing Lid to Package
16 Pin Semiconductor Package
16 Lead Flat Pack Semiconductor
Getter Lid to Package
8-Pin DIP Package
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