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Learn when you might choose one technology over the other in this blog piece: Nd:YAG for Fiber Laser Welding?
Use a picosecond laser for corrosion resistant black marking on stainless steel alloys: UDI marking, banding, part traceability
What’s all the fuss about? Read about micromachining with a femtosecond laser in our blog.
What is it and what can you do with it?
Laser soldering and plastic welding; both possible with direct diode lasers
Read our blog piece Bringing Laser Technology In House: 6 Simple Steps to Success which outlines some of the pitfalls and how to avoid when moving from contract manufacturing.
How to design ring projections for hermetic sealing.
Configure your Glovebox here
Fundamentals of Hot Bar Reflow Soldering
Check out these tips and tricks for successful setup of your micro tig welding application.
Laser or resistance technology? Which do you choose when it’s critical to prevent external environmental conditions from penetrating the package?
Projection welding of Fasteners to Hot Stamped Boron Components
Laser Cleaning Metal Improves Battery Pack Reliability. Read the blog now.
Industry increasingly relies on sensors in both factories and products. New sensor technologies mean new product capabilities with improved performance and efficiency.
Fast, clean, efficient! Read the blog.
Dark marks that are resistant to bacterial growth, passivation, corrosion and autoclaving. Read more.
High production rate + high yield = industrial process success. Understanding both the process requirements and production environment allows companies to optimize their production rates resulting in lower cost per part and higher profit.
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Semiconductor devices consist of silicon-based crystals engineered to perform complex electronic functions within integrated circuits (ICs). As the semiconductor industry continues to evolve, manufacturers produce a wide range of ICs, each with specific packaging requirements to ensure durability, performance, and protection from environmental contaminants.
These packages—commonly made from metal or ceramic—are designed to shield sensitive components while enabling electrical connectivity. Common styles include TO cans, butterfly packages, flat packs, and dual in-line packages (DIPs).
AMADA WELD TECH supports semiconductor and microelectronics manufacturing with advanced resistance welding, laser welding, and hermetic sealing technologies. Our solutions are ideal for precision joining of fine wires, leads, and housings, helping ensure the reliability, consistency, and throughput required for high-performance electronic components.
AF8500 Hermetic Sealing System
Seam Sealing Lid to Package
16 Pin Semiconductor Package
Semiconductor
Butterfly Package
16 Lead Flat Pack Semiconductor
Getter Lid to Package
TO5 Package
8-Pin DIP Package
Learn more about AMADA WELD TECH and our industry-leading products in our newsroom.
An educated customer is a happy customer! Learn more about our eight different manufacturing technologies, watch a video, schedule some training or sign up for our blog in the Learning Center.
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