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Pneumatic Hot Bar Reflow Soldering & Bonding Heads

Typical hot bar reflow soldering applications include flex circuits, ribbon cables, wires, flex to PCB, flex to LCD, and thermocompression bonding of gold ribbon as found in the telecommunications, computer, automotive, display industries and more.

Hot bar reflow soldering is achieved when two pre-fluxed, solder or adhesive coated parts are heated, causing the solder to melt, flow, and then solidify, forming a permanent electro-mechanical bond. Pneumatic bonding heads utilized in these applications are designed for single-operator, benchtop manufacturing.

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AMADA WELD TECH designs and builds a full range of pneumatic and motorized bonding heads for hot bar reflow soldering, ACF laminating, heat seal bonding and heat staking applications.

Reflow Soldering & Bonding Heads

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