DT Series Desktop ACF Laminating System

Designed for fine-pitch ACF bonding applications (> 30 micron), the DT ACF (Anisotropic Conductive Film) Laminator uses a two- or three-step process to connect materials like flex-foil to glass or flex-foil to PCB.

ACF Laminating/Pre-Bonding is achieved by dispensing and cutting the ACF tape, positioning over the surface of the parts to be bonded, and moving the thermode into position. The flex is then moved into position to align the traces to the substrate, and the thermode is actuated to complete the bond.

The basic systems includes a constant heat power supply and pneumatic bonding head. Options include the addition of interposer tape, alignment, or product jig modules.

  • Compact, flexible system design
  • Constant heat controller
  • Left-right, front-rear, or rotary product handling
  • Options include upgraded Uniflow pulsed heat power supply, light-scre...

Technical Specifications

Input Power 100 - 240 VAC, 16 A
Air 60 - 120 psi
Single or 3 Phase
Size H x W x D 20.01 in x 21.65 in x 23.62 in (510 mm x 550 mm x 600 mm)
Weight88 lb (40 kg)