Reflow Braze Bond

In a Reflow Braze Bond the resistance heating of a low temperature brazing material such as gold or solder is used to join either dissimilar materials or widely varied thick/thin material combinations. The brazing material must ‘wet’ to each part and possess a lower melting point than the two workpieces. The resultant bond has definite interfaces with minimum grain growth. Typically the process requires a longer (2 to 100 ms) heating time at low weld energy. The resultant bond exhibits excellent tensile strength, but poor peel and shear strength.