Home/Technical Glossary/Unibond® Unibond® Unibond electrodes are used for parallel gap bonding and reflow soldering. Generally, RWMA2 copper Unibond electrodes are used with resistive and/or hard materials such as gold plated kovar and nickel. Molybdenum Unibond electrodes are used for bonding conductive or soft materials such as copper or gold. The face of a Unibond electrode is 0.020 inches (0.5 mm) wide by 0.030 inches (0.75 mm) deep. In unfixtured applications, this limits their use to bonding ribbons (wire) which are at least 0.010 inches (0.25 mm) wide because of the limited visibility. For more information read our Unitip/Unibond datasheet.