ACF Laminating

ACF Laminating s a process used to ‘tack’ or hold parts (e.g. flexible circuit and PCB or flexible circuit and LCD) in place prior to ACF bonding. ACF tape is pre-cut to the required length and positioned over the part surface by placing the thermode directly on the ACF material. A light bond is achieved using pressure from the thermode and, in some cases, just enough heat to make the anisotropic material a little bit tacky.

Typical applications include flex-foils to printed circuit boards, detector modules, and displays as on computers, mobile phones, and tablets.

For more information read our article Conductive Adhesive Bonding.