ACF Laminating

ACF Laminating s a process used to ‘tack’ or hold parts (e.g. flexible circuit and PCB or flexible circuit and LCD) in place prior to ACF bonding. ACF tape is pre-cut to the required length and positioned over the part surface by placing the thermode directly on the ACF material. A light bond is achieved using pressure from the thermode and, in some cases, just enough heat to make the anisotropic material a little bit tacky.

Typical applications include flex-foils to printed circuit boards, detector modules, and displays as on computers, mobile phones, and tablets.

For more information read our article Conductive Adhesive Bonding.

News & Events - AMADA WELD TECH


Learn more about AMADA WELD TECH and our industry-leading products in our newsroom.

Visit the Newsroom

Learning Center

An educated customer is a happy customer! Learn more about our eight different manufacturing technologies, watch a video, schedule some training or sign up for our blog in the Learning Center.

Visit the Learning Center


Everyone needs a little help now and again. Visit the support center for technical documents, applications assistance, field service, customer service, sales assistance, software downloads and more.

Visit the Support Center