Unitip^®

Unitips are electrodes for parallel gap bonding of gold plated kovar, copper, or gold ribbons (wires) which are smaller than 0.010 inches (0.25 mm). They are made from two pieces of molybdenum or tungsten, which are permanently bonded to an insulating spacer. This fixed gap and bonded construction results in a tip which wears uniformly when properly dressed. The length of the Unitip and the flat area on the front allows it to bond ribbons extremely close to the walls of packages as deep as 0.450 inches (11.5 mm). The narrower Thinline “L” series Unitips have a tapered profile, enabling them to be used closer to the corners of packages.

For more information, read our Unitip/Unibond datasheet.