Hot Bar Reflow Soldering

Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder or adhesive coated parts are heated to a temperature sufficient to cause the solder or adhesive to melt, flow, and solidify, forming a permanent electro-mechanical bond between the parts. Pressure is applied throughout the cycle, so the process is suitable for parts that might otherwise disconnect during cooling down.

Hot bar reflow soldering can process multiple connections (up to > 100mm length) simultaneously, preventing wires from disconnecting while their neighbors are soldered.

Typical hot bar reflow soldering applications include flex circuits, ribbon cables, wires, flex to PCB, flex to LCD, and thermocompression bonding of gold ribbon.

For more information read the Reflow Soldering Process Overview and Part Design Guidelines for Reflow Soldering Flex to PCB’s


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