newhorizon ACF Laminating System

Designed for fine-pitch ACF bonding applications (> 30 mircon), the ACF (Anisotropic Conductive Film) Laminator uses a two- or three-step process to connect materials like flex-foil to glass or flex-foil to PCB.

ACF Laminating/Pre-Bonding is achieved by dispensing and cutting the ACF tape, positioning it over the surface of the parts to be bonded, and moving the thermode into position. The flex is then moved into position to align the traces to the substrate, and the thermode is actuated to complete the bond.

The basic systems includes a constant heat power supply and pneumatic bonding head. Options include the addition of interposer tape, alignment, and product jig modules.

  • Compact, flexible system
  • Left-right, front-rear, or rotary product handling
  • Use with 1NT thermodes

Technical Specifications

Input Power 100 - 240 VAC, 16 A
Air 87-116 psi
Single or 3 Phase Single Phase
Size H x W x D 25.59 in x 24.21 in x 27.36 (650 mm x 615 mm x 695 mm)
Weight132.27 lb (60 kg)